JPH0340953B2 - - Google Patents
Info
- Publication number
- JPH0340953B2 JPH0340953B2 JP13715283A JP13715283A JPH0340953B2 JP H0340953 B2 JPH0340953 B2 JP H0340953B2 JP 13715283 A JP13715283 A JP 13715283A JP 13715283 A JP13715283 A JP 13715283A JP H0340953 B2 JPH0340953 B2 JP H0340953B2
- Authority
- JP
- Japan
- Prior art keywords
- ring
- flat hollow
- plates
- plate
- hollow body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003507 refrigerant Substances 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000001816 cooling Methods 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 22
- 229910052782 aluminium Inorganic materials 0.000 description 16
- 238000005219 brazing Methods 0.000 description 14
- 230000005855 radiation Effects 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13715283A JPS6028254A (ja) | 1983-07-27 | 1983-07-27 | 半導体素子冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13715283A JPS6028254A (ja) | 1983-07-27 | 1983-07-27 | 半導体素子冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6028254A JPS6028254A (ja) | 1985-02-13 |
| JPH0340953B2 true JPH0340953B2 (en]) | 1991-06-20 |
Family
ID=15192031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13715283A Granted JPS6028254A (ja) | 1983-07-27 | 1983-07-27 | 半導体素子冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028254A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141867A (ja) * | 1984-12-14 | 1986-06-28 | Tsuboya Seizaburo | すじこ及びいくらの製造法 |
| US5229915A (en) * | 1990-02-07 | 1993-07-20 | Ngk Insulators, Ltd. | Power semiconductor device with heat dissipating property |
| WO2018225712A1 (ja) * | 2017-06-05 | 2018-12-13 | 秀俊 西尾 | キャビネット |
-
1983
- 1983-07-27 JP JP13715283A patent/JPS6028254A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6028254A (ja) | 1985-02-13 |
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